• Antistatic, low tribocharging
• Minimizes charge generation; material will conduct charges if grounded
• Conductive - corrosion resistant
  Ideal for long term storage
• Uniform protection
  Will not affect the solderability of device leads
• Lead-free RoHS Compliant
• Made in the United States of America
  This item is made and stocked in Canton, MA
  
  Estimated Shipping Weight: 2.38 Pounds

High Density Foam is ideal for lead insertion packaging, providing ESD and physical protection to component leads, and bringing terminals to equipotential, minimizing exposure to discharge.

Size: 24" x 36"
Volume Resistivity: 10E3 - 10E5 ohms
Surface Resistivity: 10E3 - 10E5 ohms